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Highest quality standards are achieved through the implementations of latest technology, decades of experience and everlasting moral values , which have helped us to retain our customers as well as multiply them.

Welcome to NICA TECHNOLOGIES (INDIA) PVT.LTD.

Via Hole Filling System

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Designed to fill holes in substrate with conductive or non conductive paste. And equipped with glass cover for safety and visual quality control, both side of panels can be fill in one cycle.

To ensure quality, the system automatic scavenger system will remove excess plugging paste from the surface of the printed circuit board. Once again, it is equipped with glass cover for safety and visual quality control

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* To embrace new technologies and methods. * To give unsurpassed products and services to the clients. * To constantly look for improvement and changes.

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